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Integrated circuitHybrid integrated circuitFlip chipThermal copper pillar bumpChip carrierMicrocircuitChip on boardMulti-chip moduleIntegrated passive devicesBall bondingSemiconductor packagePrinted circuit boardBall grid arrayIntegrated circuit packagingDip solderingChipReflow solderingSemiconductor device fabricationLinear integrated circuitCpu socketSemiconductor deviceSolder maskDual in-line packageMicroelectromechanical systemsSolder pasteThermally conductive padSurface-mount technologyLand grid arrayMicroviaMicrostrip antennaBall bearingContact padThermal pasteSystem in a packageLeadElectroless nickel immersion goldThrough-hole technologyPhotolithographyBarnacleSemiconductor fabrication plantReflow ovenBreadboardElectronic circuitCorePhotonic integrated circuitSemiconductor heterostructureRom cartridgeIntegrated circuit layoutTransistorMosfet applicationsSalicideMicrocontact printingBicmosBoard fingerDecappingPinoutChipletIntegrated circuit designLab-on-a-chipSmd ledRf cmosSilicon on insulatorFootprintDynamic random-access memoryTube socketElectronic symbolMicroelectromechanical systemAnodic bondingMesfetElectronic packagingCapacitorFerrite coreElectrical contactDarlington transistorTurretChip artFilm capacitorDirect couplingSense amplifierGate arrayFlat no-leads packageCartridgeStepping levelExtrinsic semiconductorPower semiconductor deviceDistribution boardBufferMixed-signal integrated circuitSolid-state electronicsEdge connectorMagnetic coreProtoboardPower moduleQuad in-line packagePrinted circuit board millingConformal coatingSmall outline integrated circuitFan-out wafer-level packagingHeterojunction bipolar transistorMicrolithography