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Front end of linePlanar processElectronic circuitSemiconductor device fabricationBackplaneSemiconductor fabrication plantIntegrated circuitCircuit designIntegrated circuit packagingSemiconductor packageSilicon on insulatorPrinted circuit boardRoutingIntegrated circuit designBall bondingSolid-state electronicsMicroviaProduct layoutPower electronic substrateThick-film technologyFabless manufacturingLinear integrated circuitSemiconductor deviceFurnace annealDie preparationLeadOverlay controlAirbridgeIntegrated circuit layoutLayoutChip carrierDicing tapeThrough-hole technologyEtchingTerminalMicrofabricationEutectic bondingRf cmosAnodic bondingMicrocircuitElectronic packagingMultiple patterningNmos logicFlip chipMedium scale integrationSemiconductor heterostructureSemiconductorPhysical verificationGate oxideSuperconducting tunnel junctionThrough-silicon viaLevel-sensitive scan designSurface-mount technologyVery large scale integrationTransmission line measurementChip on boardLarge scale integrationDip solderingDriver circuitTape-outThin-film transistorPhotonic integrated circuitThermal oxidationDelay calculationSalicideMetal gateMosfetBicmosSilicon photonicsPhotolithographyDual in-line packageIntegrated passive devicesSolder pasteSmall scale integrationProduction lineCircuit boardChipWiring loomPhotofabricationPlasma etchingProduct engineeringHeterojunction bipolar transistorElectrical networkReflow solderingElectronic symbolElectroplatingElectronicsWafer-scale integrationWire wrapElectrodeWiring harnessSolderingStencil printingPinoutGate arrayTunnel junctionElectrical wiringCrossbar switchResistance wireConformal coating