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Eutectic bondingThermocompression bondingThermal oxidationSilicon on insulatorBall bondingAnisotropic conductive filmSilicon on sapphirePhotolithographyMicrolithographyPhosphosilicate glassThermosonic bondingDiffusion bondingSolder maskChip on boardEtchingDicing tapeImmersion lithographyLiquid optically clear adhesiveAnodizingAtomic layer etchingSemiconductor deviceThin-film solar cellSemiconductor device fabricationOverlay controlAirbridgeThick-film technologyIntegrated circuit packagingFurnace annealMolecular beam epitaxyConformal coatingWaferPhysical vapor depositionMicrofabricationThrough-silicon viaFan-out wafer-level packagingConversion coatingPlanar processSelf-aligned gatePlasma electrolytic oxidationSalicideCold weldingFlip chipSemiconductor packageWafer-scale integrationElectroless copper platingMosfetThin-film transistorStrained siliconFriction stir weldingSlot-die coatingIntegrated circuitElectroplatingReflow solderingSolder pastePolycrystalline siliconPlasma ashingArc weldingThermal adhesiveRca cleanSuperconducting tunnel junctionOptical contact bondingSemiconductor heterostructureMonocrystalline siliconLeadElectroless nickel immersion goldFloat glassDiffusion-barrierIon platingSurface-mount technologySolderingChemical bath depositionDip solderingAtomic layer depositionExothermic weldingMosfet applicationsMetalorganic vapour-phase epitaxyPhotochemical machiningFe fetMetallic bondingFlexible electronicsSpot weldingLocosSilicon photonicsTunnel junctionPhotoresistMaskless lithographySemiconductorOpto-isolatorExtrinsic semiconductorContact lithographyMetal injection moldingMetal gateCrystalline siliconPhotofabricationVacuum tubeElectrodeElectric resistance weldingGlass-to-metal sealFabless manufacturingGate oxide